DesignCon is the premier educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor communities, promising to address the latest signal integrity and power integrity challenges for engineers working in high-speed designs. This 3 days conference and exhibition is being organized by UBM Canon. The venue of this event is Santa Clara Convention Center which is located in Santa Clara, California, United States of America. The event will be held from 31 January 2017, Tuesday to 02 February 2017, Thursday. DesignCon 2017 will showcase a wide range of products and services related to electronic design industry from the leading exhibitors such as pcb design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ics, semiconductor components. The approximate number of exhibitors that will exhibit at this event is over 150. Over 7,000 visitors are expected at this conference and exhibition. Visitor profile of this event includes analog engineers, application engineers, architects, ASIC Design engineers, CAD engineers, CEOs, chief engineers, component engineers, computer engineers, design engineers, development engineers, electrical engineers, engineering Managers, field application engineers, firmware engineers, hardware engineers, mechanical engineers, members of technical staff (MTS) PCB design engineers, principal engineers, product engineers, R&D engineers, senior design engineers, scientists, signal integrity engineers, software engineers, staff engineers, system architects / engineers, technical leaders, technologists, test engineers, verification engineers, VPs and directors of hardware and software engineering, R&D. The frequency of DesignCon is annual.